DeepCool EX750 heat sink compound Thermal paste 6.2 W/m·K 3 g

SKU
R-EX750-GY030C-G-1
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Out of stock
2x 1.5 g, 6.2 W/m*K Thermal Conductivity, 2.6 g/cm3 Specific Gravity
DeepCool EX750 high performance thermal paste is crafted for extremely low thermal resistance for efficient heat dissipation in any scenario. INDUSTRIAL GRADE THERMAL INTERFACE DeepCool EX750 offers extremely low thermal resistance that maximizes heat transfer and dissipation for high performance CPU & GPU (desktop/laptop) components. THE BEST MATCH, EVERY TIME A smooth consistency allows for easier application and helps fill in every microchannel between surfaces for excellent thermal conductivity. SAFE AND STABLE DeepCool EX750 is a highly stable thermal compound and not electrically conductive or hazard to your PC components.
SKU R-EX750-GY030C-G-1
EAN 6933412700111
Specification
Features
TypeThermal paste
Thermal resistance0.03 °C/W
Thermal conductivity6.2 W/m·K
Operating temperature (T-T)-50 - 250 °C
Product colourGrey
Specific gravity2.6 g/cm³
Weight & dimensions
Weight3 g
Packaging data
Package typeBlister
Quantity per pack2 pc(s)
Technical details
Package typeBlister
Thermal resistance0.03 °C/W
Thermal conductivity6.2 W/m·K
Operating temperature (T-T)-50 - 250 °C
Operational conditions
Operating temperature (T-T)-50 - 250 °C
Colour
Product colourGrey
Logistics data
Quantity per pack2 pc(s)
Manufacturer DeepCool
In Stock N