DeepCool GP/EK720-XL-2.0 heat sink compound Thermal pad

The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.

VERSATILE APPLICATIONS
The EK720 thermal pads are designed to conduct heat away from microchips to be dissipated through a heat sink. Replace aging and low-quality interfaces for increased thermal performance on chip components in laptops, graphics cards, game consoles, or in other electronics.

EFFICIENT AND EFFECTIVE
Top quality material is sourced to make the EK720 highly durable with high thermal conductivity. The pliable interface fills in any pockets and gaps between surfaces for a seamless match. Rated at 6W/mK as defined through standardized testing compared to competing products with uncertain methodologies.

SAFE HANDLING AND EASE-OF-USE
The EK720 is not electrically conductive for safe use around electronic components. This makes it extra convenient and easy for installing onto PCBs with sensitive circuitry.