Dynatron B8 computer cooling system Processor Heatsink/Radiatior Aluminium, Copper 1 pc(s)

SKU
B8
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B8, Intel Xeon, FCLGA 3647, Passive, Aluminum Stacked Fins, 4x Heat Pipes, 205W, 2U
B8
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U Server & up Solution, Support CPU Power Up to 205 Watts Heat Dissipation.
SKU B8
EAN 0855700016079
Specification
Performance
Suitable locationProcessor
Fins materialAluminium
Thermal Design Power (TDP)205 W
Number of heat pipes4
TypeHeatsink/Radiatior
Supported processor socketsLGA 3647 (Socket P)
Compatible processor seriesIntel® Xeon®
Rack capacity2U
Quantity per pack1 pc(s)
Design
Fins materialAluminium
Number of heat pipes4
Rack capacity2U
MaterialAluminium, Copper
Product colourAluminium, Copper
Technical details
Thermal Design Power (TDP)205 W
Number of heat pipes4
TypeHeatsink/Radiatior
Supported processor socketsLGA 3647 (Socket P)
Compatible processor seriesIntel® Xeon®
Rack capacity2U
MaterialAluminium, Copper
Compliance certificatesRoHS, WEEE
Power
Thermal Design Power (TDP)205 W
Colour
Product colourAluminium, Copper
Weight & dimensions
Fins thickness0.4 mm
Width80 mm
Depth108 mm
Height64 mm
Weight600 g
Packaging content
Thermal greaseYes
Other features
Thermal greaseYes
Manufacturer Dynatron
In Stock N